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Engineering Letters
Objectives and Scope Engineering Letters is published with both online and print versions. The journal covers the frontier issues in the engineering and the computer science and their applications in business, industry and other subjects. The computer science is a branch of engineering science that studies computable processes and structures. It contains theories for understanding computing systems and methods; computational algorithms and tools; methodologies for testing of concepts. The subjects covered by the journal include artificial intelligence, bioinformatics, computational statistics, database, data mining, financial engineering, hardware systems, imaging engineering, industrial engineering, internet computing, networking, operations research, scientific computing, software engineering, and their applications etc. Printed copies of the journal are distributed to accredited universities and government libraries. All the papers in the journal are also available freely with online full-text content and permanent worldwide web link. The abstracts will be indexed and available at major academic databases. ISSN: 1816-0948 (online version); 1816-093X (print version) Subject Category: Computer science and engineering Published by: International Association of Engineers
Contents: Volume 18 Issue 3 (Online version available: 19 August 2010)
JOURNAL PAPERS: A New Algorithm with Low Complexity for Adaptive Filtering M. Arezki, A. Benallal, P. Meyrueis, and D. Berkani Engineering Letters, 18:3, EL_18_3_01 [Online Full Text]
Geographical Multicast Quality of Service Routing Protocol for Mobile Ad-Hoc Networks Mohammad M. Qabajeh, Aisha H. Abdalla, Othman Khalifa, and Liana K. Qabajeh Engineering Letters, 18:3, EL_18_3_02 [Online Full Text]
Deconvolution of Neutron Degraded Images: Comparative Study between TSVD, Tikhonov Regularization and Particle Swarm Optimization Algorithm Slami Saadi, Maamar Bettayeb, and Abderrezak Guessoum Engineering Letters, 18:3, EL_18_3_03 [Online Full Text]
PVS Verification of cCSP Synchronous Semantics Shamim H. Ripon Engineering Letters, 18:3, EL_18_3_04 [Online Full Text]
Development of a Washer-Dryer with Kansei Ergonomics Shigekazu Ishihara, Keiko Ishihara, Ryo Nakagawa, Mitsuo Nagamachi, Hirofumi Sako, Yoshihisa Fujiwara, and Masahiro Naito Engineering Letters, 18:3, EL_18_3_05 [Online Full Text]
Bhave Toolset: Modeling and Analysis of Electronic System Design and System Control K.L. Man, T. Krilavicius, S. Valaskevicius, Yanyan Wu, and J.K. Seon Engineering Letters, 18:3, EL_18_3_06 [Online Full Text]
Light Bullet Creation, Routing, and Control with Planar Waveguide Arrays Matthew O. Williams, Colin W. McGrath, and J. Nathan Kutz Engineering Letters, 18:3, EL_18_3_07 [Online Full Text]
Thermomechanical Response of a Thin Sandwich Composite Structure Horatiu Teodorescu-Draghicescu, Sorin Vlase, Dana Luca Motoc, and Anghel Chiru Engineering Letters, 18:3, EL_18_3_08 [Online Full Text]
The Effect of Turbulence on the Aerodynamics of Low Reynolds Number Wings S. Watkins, S. Ravi, and B. Loxton Engineering Letters, 18:3, EL_18_3_09 [Online Full Text]
Aero-Optic Effects in Turbulent Wall-Bounded and Free Shear Flows Konstantin N. Volkov Engineering Letters, 18:3, EL_18_3_10 [Online Full Text]
Experimental Investigation of Sagging and Ballooning in LOCA for Indian PHWR Gopal Nandan, P. K. Sahoo, Ravi Kumar, B Chatterjee, D. Mukhopadhyay, and H. G. Lele Engineering Letters, 18:3, EL_18_3_11 [Online Full Text]
The Effect of Temperature Nonuniformities on Transient Behaviour of Three-Fluid Crossflow Heat Exchanger Manish Mishra, and P.K. Sahoo Engineering Letters, 18:3, EL_18_3_12 [Online Full Text]
Improvement of Microstructure and Fractured Property of Poly(L-lactic acid) and Poly(butylene succinate-co-e-caprolactone) Blend Compatibilized with Lysine Triisocyanate V. Vilay, M. Mariatti, Z. Ahmad, K. Pasomsouk, and M. Todo Engineering Letters, 18:3, EL_18_3_13 [Online Full Text]
Specification, Analyzing Challenges and Approaches for Cyber-Physical Systems (CPS) Kaiyu Wan, K.L. Man, and D. Hughes Engineering Letters, 18:3, EL_18_3_14 [Online Full Text]
Coming Special Issues of Engineering Letters Engineering Letters welcomes author submission of papers concerning any branch of the engineering and the computer science and their applications in business, industry and other subjects. The subjects covered by the journal include artificial intelligence, bioinformatics, computational statistics, database, data mining, financial engineering, hardware systems, imaging engineering, industrial engineering, internet computing, networking, operations research, scientific computing, software engineering, and their applications. With the efforts of the Editorial Board Members of Engineering Letters, the new online version and print version of the journal Engineering Letters has become available to the general public, instead of its old restricted versions. All submitted papers are to be peer-reviewed for ensuring their qualities.
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Engineering Letters
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