Information for Authors
Engineering Letters welcomes submissions of manuscripts concerning
any branch of the engineering and the computer science and their
applications in business, industry and other subjects. The subjects
of the engineering and the computer science covered by the journal
include artificial intelligence, bioinformatics, computational statistics,
database, data mining, financial engineering, hardware systems,
imaging engineering, industrial engineering, internet computing,
networking, operations research, scientific computing, software
engineering, and their applications. All submitted papers are to
be peer-reviewed for ensuring their qualities. Submissions must
be previously unpublished.
For the initial submission for reviewing, both the ps and pdf formats
are acceptable and the manuscripts can be in any conventional journal
style. Accepted manuscripts should use the following journal template. The final submission should also include the PDF version of the manuscript.
The MS Word Template (in A4 size and the IEEE two-column format) can be downloaded here (the doc file and its pdf file).
The style template for the LaTeX can be downloaded here (the zipped LaTex file).
The style template for the LaTeX along with the BibTeX template can be downloaded here (the zipped LaTex BibTeX file).
The old simple style template for the LaTeX can be downloaded here (the LaTex file and its pdf file).
Upon acceptance of a manuscript for publication, the author will not need to pay any page charge for manuscripts less than five pages.
The author or his/her institution or company will be asked to pay a mandatory page charge of US$250 for manuscripts of five to twenty pages,
while US$300 for manuscripts more than twenty pages. The authors are allowed to buy three reprints of the journal at a discount price of total
amount US$50, along with the payment of their corresponding page charges.
Call for International Advisory Board Members and Reviewers for Our Journalís Sponsored Conferences
Engineering experts and computer scientists are welcome to join the sponsored conferences of Engineering Letters as the members of the international advisory board or as reviewers. Special issues of our journal will be arranged for our sponsored conferences. Interested persons can send us an email,
along with their curriculum vitae (CV), to firstname.lastname@example.org.